1.change page3 R10 from 20K 5% to 20K 1%.
3.Change page5 BSEL circuit
4.Page6 AGP_VREF add AGP bus reference voltage R465,R466 with 2.32 ohm 1%
5.Page6 AGP_8XDET# cancel connect(pull high only)
6.Page11 add AGP_8XDET# R493 pull high 3V.
Add net RST_BTN.
2.page5 change R335,R328,R334 from 0 ohm to 33 ohm and
delete C347,C349,C351,C354 5P cpacitor.
7.Page14 change RXD0 damp resistor near to U4 source.
8.Page 14 change ACIN_SIS964 to KBC GPIO64.
9.Page 14 change BATIN# to KBC GIPO66
10.Page 14 change SIO_SMI# from SIS964 GPIO16 to GPIO10.
11.Page 14 add SIS964 GPIO7 pull high
12.Page 14 change CHG__FULL_OC from SIS964 GPIO18 to KBC GPIO62.
13.Page 14 change PM_LID# from SIS964 GPIO7 to KBC GPIO43.
14.Page 15 SIS964 UVDD33_1~3 power change to USBCMPVDD.
15.Page 16 add ESD protection D42,D43
16.Page 17 RJ45 LAN pin difine inverse
17.Page 20 change R262 from 10K to 100K ohm to reduce delay time.
18.Page 21 add MOS to switch +5V ensure +5V will not sink current when USB device plug in.
19.Page 22 change R456 from 1.3K to 330 ohm..
20.Page 23 add TPM solution..
21.Page 24 add MUTI function EMAIL_LED and SCROLL_LED.
22.Page 24 add KBC pin24 to GND for KBC select.
23.Page 26 change from TAN_capacitor to ceramic.
24.Page 27 change SE/BTL select.
25.Page 26 add CODEC pin 22(MIC2) conect pin 21
26.Page 28 change R258 from 100K to 470K for power sequence.
27.Page 28 change R258 from 10K to 150K for power sequence.
28.Page 27 Jack GND net change to GND_JACK for EMI
29.Page 26 add L57,L58,L59 for EMI
30.Page 26 add L57,L58,L59 for EMI
31.Page 21 change CPU hole H4,H5,H6,H7 NPTH to PTH and add J10 spring for EMI
32.Page 21 add FUSE F2 and L53,L54,L55,L56 change to 600ohm/100MHz
33.Page 21 change CPU hole H4,H5,H6,H7 NPTH to PTH and add J10 spring for EMI
34.Page 3 Q4 N-MOSFET change to drain connect R31 pin1 source connector GND
35.Page 5 Change C316,C413 from 12PF to 33PF
36.Page 14 Change C175,C179 from 18PF to 15PF...
Se o download não iniciar automaticamente clique aqui